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Features
The Radio
- Qualified to Bluetooth Specification 1.1
- Integrated VCO, synthesizer, LNA, PA, and channel filters
- Class 2 and 3 (up to 10 meters) operation
- Greater than +2dBm RF output power
- Better than -80dBm RF sensitivity
- Crystal independent Fractional-N synthesizer
- Digital frequency error compensation
- RSSI RF output power control
- Supports Class 1 operation with external PA
The Baseband
- Qualified to Bluetooth Specification 1.1
- Supports all ACL and SCO packet types
- Maximum 723 Kbps data transfer rate
- Point-tomultipoint Piconet and Scatternet
- Built-in hardware CVSD audio codec
- PCM interface for external linear, A-Law and -Law codec
- Park, Sniff, and Hold power saving modes
- Full-speed USB host interface at 12 Mbps
- 4-Wire UART host interface at 2.4 to 921 Kbps
Fusion of Technologies
Constructed with the latest System-in-Package (SiP)
technology, the KC6101 is a sophisticated, yet cost-effective Bluetooth
solution that offers the best of both CMOS and BiCMOS technologies
in a single package. Combining the Baseband and Radio, each manufactured
in process technologies best suited for its function and design,
the KC6101 offers a compelling solution that addresses the key requirement
of low power, low cost and small foot print of any Bluetooth system.
Optimum Performance
Overall superior system performance is attributed to
the inherent properties of CMOS and BiCMOS technologies. With the
combination of CMOS Baseband and BiCMOS Radio, KC6101 achieves the
lowest power consumption in the industry while maintaining the highest
RF sensitivity. Electrical performance enhancements come from the
close proximity of dice within the package and the sophistication
of substrate design. By placing the Baseband and Radio closer together
on the same substrate, major improvements in timing skews and inductance
control can be achieved over individually packaged ICs. Spatial allocation
and performance-tuned routing built into the multi-layer substrate
further help the KC6101 in reducing crosstalk and interference while
preserving signal integrity.
Low Cost Integration
SiP Technology helps reducing the total cost of
ownership in both manufacturing and design. The SiP process is based
on existing high-volume, high-yield, and low-cost assembly technologies
that are widely available in the industry. All equipments and materials
are industry standard that has been proven to produce consistent
quality. To help reducing cost on system integration, SiP moves
the signal routing complexity into the substrate of KC6101, thus
reducing the high layer count and the design complexity of the system
board. Not only can system boards be designed smaller and manufactured
economically, performance tuning and design changes can be made
to the SiP without changing the system board.
Fast Time to Market
By fine-tuning the design and process of the Baseband
and Radio in parallel, SiP does not suffer from the long development
cycle and high cost associated with a SoC design. SiP gives KC6101
maximum design flexibility and faster revision cycle that directly
translate to shorten time-to-market of our customers?products. With
most of the complexity built into the substrate, KC6101 is an ideal
solution for Bluetooth modules, it reduces the revision cycles of
module design and accelerates production readiness.
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Bluetooth
